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US Patent Issued to Air Products and Chemicals on Jan. 27 for "Apparatus and process for pre-liquefaction fluid processing for improved liquefaction operations" (Pennsylvania Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,267, issued on Jan. 27, was assigned to Air Products and Chemicals Inc. (Allentown, Pa.). "Apparatus and process for pre-liquefaction fluid... Read More


US Patent Issued to Bose on Jan. 27 for "Cover for an earbud charging case" (Massachusetts Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. D1,110,026, issued on Jan. 27, was assigned to Bose Corp. (Framingham, Mass.). "Cover for an earbud charging case" was invented by Steven A. Silve... Read More


US Patent Issued to Hyundai Mobis on Jan. 27 for "Cockpit system including operating system configured to use projector" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,220, issued on Jan. 27, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Cockpit system including operating system configured ... Read More


US Patent Issued to Dell Products on Jan. 27 for "Collective intelligence immunity cyber detection and protection" (Israeli Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,537,827, issued on Jan. 27, was assigned to Dell Products LP (Round Rock, Texas). "Collective intelligence immunity cyber detection and protect... Read More


US Patent Issued to BYD on Jan. 27 for "Pallet truck" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. D1,110,664, issued on Jan. 27, was assigned to BYD Co. Ltd. (Shenzhen, China). "Pallet truck" was invented by Kai Tan (Shenzhen, China), Zhiqiang ... Read More


US Patent Issued to BROTHER KOGYO on Jan. 27 for "Image forming device configured to cut sheet- type medium and form image on cut medium" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,761, issued on Jan. 27, was assigned to BROTHER KOGYO K.K. (Nagoya, Japan). "Image forming device configured to cut sheet- type medium and ... Read More


US Patent Issued to STATS ChipPAC on Jan. 27 for "Semiconductor device and method of forming module-in-package structure using redistribution layer" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,840, issued on Jan. 27, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of forming module-in-package ... Read More


US Patent Issued to MACRONIX INTERNATIONAL on Jan. 27 for "Data optimization for high bandwidth (HBW) NVM AI inference system" (American, Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,536,404, issued on Jan. 27, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan). "Data optimization for high bandwidth (HBW) NVM ... Read More


US Patent Issued to SHENZHEN S-HANDE TECHNOLOGY on Jan. 27 for "Massager capable of automatically fitting and pressing" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,533,288, issued on Jan. 27, was assigned to SHENZHEN S-HANDE TECHNOLOGY Co. LTD. (Shenzhen, China). "Massager capable of automatically fitting ... Read More


US Patent Issued to SNF GROUP on Jan. 27 for "Binder composition for iron ore agglomeration" (French Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,534,614, issued on Jan. 27, was assigned to SNF GROUP (Andrezieux-Boutheon, France). "Binder composition for iron ore agglomeration" was invent... Read More